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In-field Monitoring of On-Chip Thermal, Power Distribution Network, and Power Grid Reliability

机译:片上热,配电网络和电网可靠性的现场监控

摘要

Various embodiments may include methods and systems for monitoring characteristics of a system-on-a-chip. Various embodiments may include inputting, from a test data input connection, test data to a first scan chain section including a first group of logic gates located within a first region of the SoC. Various embodiments may include providing, from a first clock gate associated with the first region of the SoC, a clock signal to the first group of logic gates. Various embodiments may include measuring, using a first sensor, the characteristics at a second region of the SoC in response to providing the clock signal to the first group of logic gates. Embodiments may further include processing or analyzing measured characteristics to determine a testing result.
机译:各种实施例可以包括用于监视系统上芯片特性的方法和系统。 各种实施例可以包括从测试数据输入连接输入,测试数据到第一扫描链部分,包括位于SoC的第一区域内的第一组逻辑门。 各种实施例可以包括从与SOC的第一区域相关联的第一时钟栅极提供给第一组逻辑门的时钟信号。 各种实施例可以包括使用第一传感器测量SOC的第二区域处的特性,响应于向第一组逻辑门提供时钟信号。 实施例还可以包括处理或分析测量的特性以确定测试结果。

著录项

  • 公开/公告号US2021294398A1

    专利类型

  • 公开/公告日2021-09-23

    原文格式PDF

  • 申请/专利权人 QUALCOMM INCORPORATED;

    申请/专利号US202016826729

  • 发明设计人 PALKESH JAIN;RAHUL GULATI;

    申请日2020-03-23

  • 分类号G06F1/20;G01R31/317;G06F1/3203;

  • 国家 US

  • 入库时间 2022-08-24 21:12:37

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