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Heat conductive silicone gel composition, heat conductive silicone sheet and its manufacturing method

机译:导热硅胶凝胶组合物,导热硅胶片及其制造方法

摘要

An organopolysiloxane containing at least two alkenyl groups in one molecule(b) an organohydrogenpolysiloxane having at least two hydrogen atoms directly bonded to a silicon atomPlatinum group metal based catalystsFor a total of 100 mass parts of the above (a) - (c) component(d) the aluminum hydroxide particle which is a thermally conductive particle containsWhen this is used as a parent (D-1) particle size (D50) is μ More than 40% by weight of aluminum hydroxide particles over(D-2) particle size (D50) is μ Aluminum hydroxide particles less than m contain 25% by mass and 60% by mass or lessThe dielectric constant of the interdielectric bridge method isShore OO hardness is 5 to 60.This provides a silicone gel composition with high safety, flexibility, low dielectric constant, and heat conductivity, using external material for GHS classification.
机译:一种分子(b)中的含有至少两个链烯基的有机聚硅氧烷(b)的有机氢聚硅氧烷,其具有至少两个直接粘合到硅ATOMPOLATINUM基金金属基金属基催化剂的氢原子,所述催化剂总共100种(a) - (c)组分( d)作为母体(D-1)颗粒尺寸(D50)的导热颗粒含有导热颗粒的氢氧化铝粒子是μm氢氧化铝颗粒(D-2)粒度( D50)是小于M的μ铝氢氧化铝颗粒,含有25质量%和60质量%或更少的介电桥法的介电常数为5至60.本质提供了具有高安全性,柔韧性,低的硅胶组合物。 介电常数,以及导热性,使用外部材料进行GHS分类。

著录项

  • 公开/公告号JP6938808B1

    专利类型

  • 公开/公告日2021-09-22

    原文格式PDF

  • 申请/专利权人 富士高分子工業株式会社;

    申请/专利号JP20210537930

  • 发明设计人 東堂 真悟;

    申请日2021-03-26

  • 分类号C08L83/07;C08L83/05;C08K3/013;C08K3/22;C09K5/14;C08K3/26;C08K3/36;C08K3/38;C08K3/28;C08K5/5419;C08J5/18;

  • 国家 JP

  • 入库时间 2022-08-24 21:10:23

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