RADIANT COOLING DEVICE AND RADIANT COOLING METHOD

摘要

Provided is a radiant cooling device that can be made flexible and can cool an object to be cooled, even in a solar radiation environment.　The radiant cooling device comprises: an infrared radiation layer A that radiates infrared light IR from a radiation surface H; a light reflection layer B that is located on the opposite side of the infrared radiation layer A from the side where the radiation surface H is present; and a protection layer D that is between the infrared radiation layer A and the light reflection layer B. The infrared radiation layer A is a resin material layer J that has been adjusted to a thickness such that thermal radiation energy that is greater than absorbed sunlight energy is released in an 8 μm to 14 μm wavelength band. The light reflection layer B comprises silver or a silver alloy. The protection layer D is configured from a polyolefin resin at a thickness of 300 nm to 40 μm, or is configured from an ethylene terephthalate resin at a thickness of 17 μm to 40 μm.