首页> 外国专利> SUBSTRATE PROCESSING DEVICE, JIG, CALIBRATION METHOD FOR SUBSTRATE PROCESSING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SUBSTRATE PROCESSING DEVICE, JIG, CALIBRATION METHOD FOR SUBSTRATE PROCESSING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

机译:基板处理装置,夹具,衬底处理装置的校准方法,以及制造半导体器件的方法

摘要

Provided is an invention that has: a processing container in which a substrate is processed; a port that, inside the processing container, forms an opening through which a temperature-measuring instrument having a protective tube is inserted facing upward; and a non-metal jig that covers the inner surface of the opening of the port, and is formed in a cylindrical shape that can be mounted in the port from inside the processing container. The jig inserted in the port is configured to be able to move up and down together with the temperature-measuring instrument when the temperature-measuring instrument is mounted in the port.
机译:提供了一种发明,其具有:处理基板的处理容器; 在处理容器内部的端口形成一个开口,通过该开口,具有保护管的温度测量仪器面朝上插入; 和覆盖端口的开口的内表面的非金属夹具,并且形成为圆柱形,其可以从处理容器内部安装在端口中。 插入端口中的夹具被配置为能够在端口中安装在端口中时与温度测量仪器一起向上移动。

著录项

  • 公开/公告号WO2021176879A1

    专利类型

  • 公开/公告日2021-09-10

    原文格式PDF

  • 申请/专利权人 KOKUSAI ELECTRIC CORPORATION;

    申请/专利号WO2021JP02288

  • 发明设计人 SAKASHITA KEISUKE;

    申请日2021-01-22

  • 分类号H01L21/31;C23C16/46;

  • 国家 JP

  • 入库时间 2024-06-14 22:03:16

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