SOLDER PASTE, METAL-COATED PARTICLE FOR SOLDER PASTE, AND CONNECTION STRUCTURE

摘要

The present invention provides a solder paste which does not easily wet and expand in an unintended area at a time of connection, easily maintains a shape of a connection portion formed by the solder paste in a connection structure after the connection, and is capable of maintaining a high connection strength even if the connection structure after the connection is subjected to a thermal shock or a physical impact.　A solder paste according to the present invention includes a plurality of solder particles and a plurality of metal-coated particles. The metal-coated particle has a specific gravity of 6.0 or less and includes a base material particle and a metal portion disposed on a surface of the base material particle. The metal portion includes metal capable of forming an intermetallic compound with solder, includes metal capable of performing melt-bonding with solder, or includes metal capable of diffusing with solder.