THIN FILM SPECIMEN FOR TENSILE TEST AND PHYSICAL PROPERTY EVALUATION METHOD FOR THIN FILM SPECIMEN

摘要

The present invention relates to a physical property evaluation method for a thin film specimen and a thin film specimen for a tensile test. In the present invention, a digital image correlation analysis method is used to analyze a deformation ratio of a speckle pattern formed on a thin film specimen in a tension test for the thin film specimen. Therefore, the present invention can enhance the reliability of a measured physical property and prevent abnormal breaking of a metal thin film specimen.