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HIGH DENSITY ARCHITECTURE DESIGN FOR 3D LOGIC AND 3D MEMORY CIRCUITS
HIGH DENSITY ARCHITECTURE DESIGN FOR 3D LOGIC AND 3D MEMORY CIRCUITS
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机译:3D逻辑和3D存储电路的高密度架构设计
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摘要
Techniques herein include methods of forming higher density circuits by combining multiple substrates via stacking and bonding of individual substrates. High voltage and low voltage devices along with 3D NAND devises are fabricated on a first wafer, and high voltage and low voltage devices and/or memory are then fabricated on a second wafer and/or third wafer.
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