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Method, support frame and joining kit for connecting semiconductor detector elements with electronic components

机译:用于将半导体探测器元件与电子元件连接的方法,支持框架和连接套件

摘要

The invention relates to a method for connecting a plurality of semiconductor detector elements (52) to a corresponding plurality of electronic components using a flat support element (41), the flat support element (41) having an adhesive partial surface (42) at least on a first side of its flat extension ), with the steps of: taking up the plurality of semiconductor detector elements (52) from the storage element, orienting the flat carrier element (41) with the plurality of semiconductor detector elements (52) arranged thereon in a direction according to the application to a joining device and performing a joining method for connecting the Plurality of semiconductor detector elements (52) with the corresponding plurality of electronic components. The invention also relates to a carrier frame (51), the carrier frame (51) having a first frame element (21) and a flat carrier element (41) which is positioned in an opening (22) of the carrier frame (51). The invention also relates to an assembly set comprising a support frame (51) and a storage element, the storage element being designed to accommodate a plurality of semiconductor detector elements (52) in a predetermined arrangement.
机译:本发明涉及一种方法,用于使用具有至少一个粘合剂的部分表面(42)的平坦支撑元件(41),该平坦的支撑元件(41)的多个半导体检测元件(52)连接到相应的多个电子部件的它的平坦延伸部的第一侧),具有以下步骤:占用从存储元件的多个半导体检测器元件(52),与配置在所述多个半导体检测器元件(52)定向所述扁平载体元件(41)根据应用到接合装置和用于与所述对应的多个电子部件的连接半导体检测器元件的多元性(52)进行的接合方法在其上的方向。本发明还涉及一种被定位在承载框架的开口(22)上的承载框架(51),所述承载框架(51)具有第一框架元件(21)和平坦的承载元件(41)(51) 。本发明还涉及一种组件,组,其包含支撑框架(51)和一个存储元件,所述存储元件被设计为容纳多个以预定的布置半导体探测器元件(52)的。

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