Packaging paperboard and method for manufacturing same

摘要

A packaging paperboard is provided that includes two or more layers with an antenna pattern printed on one layer of the two or more layers, and an RFIC element adhered to the other layer of the two or more layers. In a laminate having the layers stuck together, the RFIC element and the antenna pattern are interposed between the layers to configure an RFIC device in which the RFIC element and the antenna pattern are electrically connected.