INSTITUTIONS, INSTITUTIONS, PACKAGING BODIES AND MANUFACTURING PROCEDURES

摘要

This application provides a pin, a pin combination structure, a package body, and a method for manufacturing a package body. A cover plate or a skirt structure is sleeved on the pin, to prevent, when a plastic packaging material is filled, the plastic packaging material from overflowing from a cavity that accommodates the plastic packaging material and that is in a mold for packaging the package body. The pin is applied to the package body, where the package body includes the pin, a substrate, and the plastic packaging material, and the pin includes a body and a baffle structure; a bottom of the body is soldered to the substrate, the baffle structure is sleeved on a middle of the body, and the plastic packaging material covers the substrate and wraps a bottom-to-middle part of the body; and the baffle structure is configured to prevent the plastic packaging material from overflowing from the cavity when the plastic packaging material is filled into the cavity, the cavity is a cavity that accommodates the plastic packaging material and that is in a mold for packaging the package body, the cavity accommodates the bottom-to-middle part of the body and the substrate, the substrate is located at a bottom of the cavity, the middle of the body is located at a top of the cavity, and a side wall at the top of the cavity abuts against the baffle structure of the body.