HEAT TRANSFER SHEET, METHOD FOR PRODUCING HEAT TRANSFER SHEET, HEAT DISSIPATION COMPONENT AND METHOD FOR PRODUCING HEAT DISSIPATION COMPONENT

摘要

The present invention provides a heat transfer sheet which is used by being interposed between an electronic component and a heat dissipation body, and which comprises: a heat transfer sheet main body that contains a thermally conductive filler; a first adhesive layer that is arranged so as to be in contact with the entirety of a first surface of the heat transfer sheet main body; a second adhesive layer that is arranged so as to be in contact with a part of a second surface of the heat transfer sheet main body, said second surface being on the reverse side of the first surface; a first release film that is arranged so as to be in contact with a surface of the first adhesive layer, said surface being on the reverse side of the heat transfer sheet main body-side surface; and a second release film that is arranged so as to be in contact with a surface of the second adhesive layer, said surface being on the reverse side of the heat transfer sheet main body-side surface.