COMPOSITE METAL FOIL, COMPOSITE METAL FOIL WITH CARRIER, METAL-CLAD LAMINATE OBTAINED USING SAID COMPOSITE METAL FOIL OR SAID COMPOSITE METAL FOIL WITH CARRIER, AND PRINTED WIRING BOARD

摘要

An object of this invention is provision of the composite metal foil for printed wiring board manufacture which has three characteristics of low thermal expansion performance better than copper, favorable electroconductive performance, and favorable solubility by copper etching liquid. In order to achieve this object, it is a composite metal foil consisting of one or more copper layers and one or more nickel alloy layers, wherein the nickel alloy layer is formed of a nickel-molybdenum alloy, and the total thickness of the one or more copper layers is T employs a composite metal foil, characterized in that to satisfy the relationship _Mo / _Cu ≤1.70 T, etc. _-Cu, one layer or more of the art nickel-when the _Mo,Ni 0.08≤T _- the total thickness of the molybdenum alloy layer T _Ni.