首页> 外国专利> COMPOSITE METAL FOIL, COMPOSITE METAL FOIL WITH CARRIER, METAL-CLAD LAMINATE OBTAINED USING SAID COMPOSITE METAL FOIL OR SAID COMPOSITE METAL FOIL WITH CARRIER, AND PRINTED WIRING BOARD

COMPOSITE METAL FOIL, COMPOSITE METAL FOIL WITH CARRIER, METAL-CLAD LAMINATE OBTAINED USING SAID COMPOSITE METAL FOIL OR SAID COMPOSITE METAL FOIL WITH CARRIER, AND PRINTED WIRING BOARD

机译:复合金属箔,带载体的复合金属箔,使用复合金属箔或带载体的复合金属箔和印制线路板获得金属复合层压板

摘要

is an object of the invention to provide a composite foil for preparing printed wiring board combines the three properties of good solubility due to a low thermal expansion than the good performance, good conductivity of copper and a copper etching solution. To achieve this goal, and one or more layers of copper layers, a composite metal foil made of a least one layer of a nickel alloy layer, the art of nickel alloy layer is a nickel-will form a molybdenum alloy, the total thickness of the at least one layer of copper layer T Cu , the art one or more layers of nickel-when a Mo -the total thickness of the molybdenum alloy layer T Ni , 0.08 T sub Ni - Mo / T Cu composite according to claim satisfies the relationship of 1.70 It employs a metal foil and so on. ;
机译:发明内容本发明的目的是提供一种用于制备印刷线路板的复合箔,该复合箔结合了良好的溶解性的三个特性,这归因于低的热膨胀性而不是良好的性能,铜的良好导电性和铜蚀刻溶液。为了达到这个目标,需要一层或多层铜层,由至少一层镍合金层制成的复合金属箔,该镍合金层的技术是将镍形成钼合金,总厚度为至少一层铜层T Cu ,即一层或多层镍-当 Mo 时-钼合金层T 的总厚度Ni ,0.08 T sub> Ni Sub>- Mo / T Cu 复合材料1.70的关系它使用金属箔等。 ;

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