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Electronic component inspection equipment and electronic component inspection method

机译:电子元件检测设备和电子元件检测方法

摘要

To provide a technique which enables detection of a defect in a rear face of an electronic component continuously generated due to a stage, preventing reduction in a yield of the electronic component.SOLUTION: An inspection device 100 comprises: a rear face image-capturing camera 4 which captures an image 9 of a rear face of an electronic component 1 transported from a stage 2; an image processing section 6 which extracts, from the image 9 of the rear face captured by the rear face image-capturing camera 4, for a plurality of electronic components 1, a defect 10 in the rear face of each of the electronic components 1; and a control section 7 which sets a virtual region 12 for an origin 11 of the defect 10 in the rear face of each of the electronic components 1 extracted by the image processing section 6 and determines quality of a surface of the stage 2 on the basis of the number of electronic components 1 including, in the virtual region 12, an origin 14 of a region 13 where a plurality of virtual regions 12 for the different electronic components 1 intersect.SELECTED DRAWING: Figure 1
机译:为了提供一种能够在由于阶段连续产生的电子元件的后表面中检测缺陷的技术,防止了电子元件的产量的降低。炫亮:检查装置100包括:后表面图像捕获相机图4所示,捕获从阶段2运输的电子元件1的后表面的图像9;从后面图像捕获相机4捕获的后表面​​的图像9中提取的图像处理部分6,用于多个电子元件1,每个电子元件1的后表面中的缺陷10;和控制部分7将虚拟区域12设定用于由图像处理部分6提取的每个电子元件1的后表面中的缺陷10的原点11,并在基础上确定级2的表面的质量包括在虚拟区域12中的电子元件1的数量包括在不同电子元件1的多个虚拟区域12的区域13中的原点14。选择的绘图:图1

著录项

  • 公开/公告号JP6917959B2

    专利类型

  • 公开/公告日2021-08-11

    原文格式PDF

  • 申请/专利权人 三菱電機株式会社;

    申请/专利号JP20180153994

  • 发明设计人 植田 淑之;金沢 守道;野口 貴也;

    申请日2018-08-20

  • 分类号G01N21/88;G01N21/956;H01L21/66;

  • 国家 JP

  • 入库时间 2022-08-24 20:31:21

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