Film Structure for Electric Field Induced Photoresist Patterning Process

摘要

Methods and apparatus are provided for minimizing line edge/width roughness in lines formed by photolithography. In one example, a method of processing a substrate comprises applying a photoresist layer comprising a photoacid generator on a multilayer disposed on the substrate, the multilayer comprising: an organic material, an inorganic material, or an organic material; an underlying layer formed of a mixture of inorganic materials, wherein in a lithographic exposure process exposing a first portion of the photoresist layer not protected by the photomask to radiant light, and in a substantially vertical direction, generated from the photoacid generator and applying an electric or magnetic field to alter the movement of the mine.