Sinter Bonding Method using Copper Formate Preform and Sinter-Bonded Structure by the Same

摘要

The present invention comprises the steps of preparing a copper formate preform from copper formate powder; and laminating the copper formate preform between the first and second members to be joined, raising the temperature to a sintering temperature of 220 to 350° C., and then sintering under pressure at the sintering temperature for 0.2 to 20 minutes. By means of copper nanoparticles generated by thermal decomposition of the formate preform, the metal finish of the surfaces of the first and second members to be joined is sintered and bonded, so that the sintering bonding process is performed at a low temperature and high speed while having excellent price competitiveness. Provided are a sintered bonding method using a copper formate preform capable of doing so, and a sintered bonding structure having excellent heat resistance and long-term reliability thereby.