TIN OR TIN ALLOY ELECTROPLATING SOLUTION, METHOD FOR FORMING BUMPS, AND METHOD FOR PRODUCING CIRCUIT BOARD

摘要

One mode of this tin or tin alloy electroplating solution contains: a soluble salt (A) including at least a first tin sa one or more compounds (B) selected from the group consisting of organic acids, inorganic acids, and salts thereof; a surfactant (C) which is a polyoxyethylene polycyclic phenyl ether sulfuric acid ester salt represented by general formula (1); and a leveling agent (D). Note that in general formula (1), m represents an integer of 1-3, n represents an integer of 10-30, and X represents a cation.