Provided is a bonding sheet which uses copper particles, and with which it is possible to: mitigate a decrease in sintering ability due to oxidation of the copper particles; form a bonding layer that is minutely formed and has few voids; and join electronic components and the like at a high bonding strength. A bonding sheet (1) comprises: copper particles (2); and a solvent (3) with a boiling point of 150°C or greater. The copper particles (2) are formed such that the surface thereof is coated with an organic protective film, the ratio of the copper particles (2) to the solvent (3) contained in the bonding sheet is 99:1 to 90:10 by mass, and the BET diameter of the copper particles (2) is in the range of 50 nm to 300 nm, inclusive.
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