首页> 外国专利> ULTRASONIC METAL BONDING MACHINE, METAL SHEET BONDING METHOD USING THE SAME, AND BONDED METAL SHEET OBTAINED BY USING THE ULTRASONIC METAL BONDING MACHINE OR THE METAL SHEET BONDING METHOD

ULTRASONIC METAL BONDING MACHINE, METAL SHEET BONDING METHOD USING THE SAME, AND BONDED METAL SHEET OBTAINED BY USING THE ULTRASONIC METAL BONDING MACHINE OR THE METAL SHEET BONDING METHOD

机译:超声波金属粘结机,使用相同的金属板粘结方法以及使用超声波金属粘结机或金属板粘结方法获得的粘结金属板

摘要

PROBLEM TO BE SOLVED: To provide an ultrasonic metal bonding machine providing a bonded metal sheet having uniform bonding strength without decreasing the strength while suppressing considerable increase in the bonding cost; to provide a metal sheet bonding method using the same; and to provide a bonded metal sheet obtained by using the ultrasonic metal bonding machine or the metal sheet bonding method.;SOLUTION: In the ultrasonic metal bonding machine 1, a top face 2a of an anvil 2 is constituted of a large number of projecting parts 2b. The height of these projecting parts 2b is set to be a fixed value so that the top face 2a of the anvil 2 is flat. A distal end portion 31 of a horn 3 has four pressing sections 32, and a distal end face 3a of each pressing section 32 is constituted of a large number of projecting parts 3b. In these projecting parts 3b, the projecting parts 3b on the outer side are projected more than the projecting parts 3b on the center side so that the cross section of the distal end portion face 3a has a curved shape so that the inner side is recessed.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种超声波金属粘接机,其在不降低强度的同时抑制粘接成本的大幅上升,并且提供具有均匀的粘接强度的粘接金属板。提供一种使用该方法的金属板粘结方法;并提供通过使用超声波金属粘合机或金属片粘合方法获得的粘合金属板。;解决方案:在超声波金属粘合机1中,砧座2的顶面2a由大量的突出部分组成2b。这些突出部2b的高度被设定为固定值,以使砧座2的顶面2a平坦。变幅杆3的前端部31具有四个按压部32,每个按压部32的前端面3a由大量的突出部3b构成。在这些突出部3b中,外侧的突出部3b比中央侧的突出部3b突出,从而前端部面3a的截面呈弯曲形状,以使内侧凹陷。 ;版权:(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP2009241120A

    专利类型

  • 公开/公告日2009-10-22

    原文格式PDF

  • 申请/专利权人 CALSONIC KANSEI CORP;

    申请/专利号JP20080091698

  • 发明设计人 YOSHIOKA SHINICHI;GOI HIROSHI;

    申请日2008-03-31

  • 分类号B23K20/10;

  • 国家 JP

  • 入库时间 2022-08-21 19:46:00

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