Via structure for reducing crosstalk between differential signal pairs, integrated circuit layer, integrated circuit system and method for their production

摘要

An integrated circuit layer (500) comprising a plurality of vias (132, 300, 350): a first conductive element (P1) contained in a first via; a second conductive element (P2) contained in a second via, wherein the first via is arranged at a first distance from the second via; a third conductive element (N1) which is contained in a third via, the third via being arranged at a second distance from the second via and the first distance and the second Spacing are substantially the same; anda fourth conductive element (N2) contained in a fourth via, wherein the fourth via is arranged at a third distance from the first via and at a fourth distance from the third via, and wherein the third distance and the fourth distance are substantially the same are; anda redistribution layer (134), wherein the first guiding element (P1) and the third guiding element (N1) comprise a first differential signal pair and the second guiding element (P2) and the fourth guiding element (N2) comprise a second differential signal pair, the first guiding element ( P1) with a first ball (S), the second guide element (P2) with a second ball (S), the third guide element (N1) with a third ball (S) and the fourth guide element (N2) with a fourth ball (S ) is electrically connected, wherein the first, second, third and fourth ball (S) are contained in a ball grid arrangement, a direction from the first guide element (P1) to the third guide element (N1) from a direction from the first ball (S) to the third ball (S), wherein a direction from the second guide element (P2) to the fourth guide element (N2) differs from a direction from the second ball (S) to the fourth ball (S), wherein the redistribution layer (134) different Umverte provides ilungswege, which connects each of the balls (S) to another conductive element in a via.