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Paperboard for packaging and its manufacturing method

机译:包装纸板及其制造方法

摘要

To provide a packaging and a packaging paperboard having an RFID function with better communication characteristics, and a method for manufacturing the packaging paperboard having such the RFID function.SOLUTION: A packaging paperboard is configured so that a plurality of antenna patterns are printed with predetermined distance on one layer of the packaging paperboard having at least two layers, a plurality of RFIC elements is adhered to the other layer with the predetermined distance, the two layers are adhered to each other, the RFIC elements and the antenna patterns are sandwiched between the layers, and the RFIC elements and the antenna patterns are electrically connected.SELECTED DRAWING: Figure 1
机译:提供一种具有具有更好通信特性的RFID函数的包装和包装纸板,以及用于制造具有这种RFID功能的包装纸板的方法。展开:包装纸板被配置成使得多个天线图案被预定距离打印在具有至少两层的包装纸板的一层上,多个RFIC元件用预定距离粘附到另一层,两层彼此粘附,RFIC元件和天线图案夹在层之间,以及RFIC元素和天线图案是电连接。选择图:图1

著录项

  • 公开/公告号JP6911958B2

    专利类型

  • 公开/公告日2021-07-28

    原文格式PDF

  • 申请/专利权人 株式会社村田製作所;

    申请/专利号JP20200042206

  • 发明设计人 加藤 登;三浦 哲平;

    申请日2020-03-11

  • 分类号G06K19/077;B65D77;H01P11;H01Q1/38;

  • 国家 JP

  • 入库时间 2022-08-24 20:11:39

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