The utility model relates to devices for cooling electronic devices, namely to radiators that carry out heat exchange between the housing of electronic devices and the cooling medium. EFFECT: increased efficiency of heat removal. The essence: the cooling device contains a radiator, a printed circuit board, which is provided with at least one hole. The printed circuit board also contains a dielectric substrate and heat-conducting layers on both sides, attachment points. The radiator contains a heat sink, a wall with a mounting surface for an electrical component, fins and is installed on the heat-conducting layer of the printed circuit board with a heat sink. The wall with the mounting surface for the electrical component is made at an angle to the printed circuit board in such a way that the two channels formed by the heat sink, the wall with the mounting surface for the electrical component, the ribbing and the printed circuit board are made expandable. The finning elements forming the channels are made with air gaps between them. At least one hole is made through and is located opposite the air channel. The thermal contact of the electrical component with the wall with the mounting surface and the thermal contact of the heat sink with the heat-conducting layer of the printed circuit board is provided by installing a gasket made of heat-conducting material between the contacting surfaces and tightening the attachment points. 1 wp f-ly, 3 dwg
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