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CHIP CARD MODULE, CHIP CARD, CHIP CARD ARRANGEMENT, METHOD FOR DESIGNING A CHIP CARD MODULE AND METHOD FOR DESIGNING A CHIP CARD
CHIP CARD MODULE, CHIP CARD, CHIP CARD ARRANGEMENT, METHOD FOR DESIGNING A CHIP CARD MODULE AND METHOD FOR DESIGNING A CHIP CARD
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机译:芯片卡模块,芯片卡,芯片卡布置,设计芯片卡模块的方法和设计芯片卡的方法
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摘要
Chip card module (200a), comprising: a carrier (228) with a first side and an opposite second side; a chip (330) which is mounted on the carrier (228) in FCOS flip-chip technology, the chip (330) has a first chip contact (330C1); a first and a second antenna contact (220M1, 222_1 or 220M2, 222_2), formed over the first side; a metal-free area (224) which extends over the first side between the first antenna contact (220M1, 222_1) and the second antenna contact (220M2, 222_2), the metal-free region (224) extending between a first edge section (228E1) and a second edge section (228E2) of the carrier (228); anda first chip connection (226M1, 226MX, 226M3, 222_3, 220M3, 220C1) which electrically connects the first chip contact (330C1) to the first antenna contact (220M1, 222_1), wherein the first chip connection (226M1, 226MX, 226M3, 222_3, 220M3 , 220C1) is arranged at least partially over the second side in an area opposite the metal-free area (224), the first and second antenna contacts (220M1, 222_1 and 220M2, 222_2) containing through holes (222_1, 222_2).
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