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METHOD FOR PRODUCING AN ADVANCED SUBSTRATE FOR HYBRID INTEGRATION

机译:用于制造用于混合集成的先进基板的方法

摘要

The method comprises the following steps: - providing a receiving substrate (20) and a donating substrate (10) successively comprising: a support substrate (11), a sacrificial layer (12) which can be selectively etched in relation to an active layer (13) and a silicon oxide layer (14) which is arranged on the active layer (13); - forming a cavity in the oxide layer (14) in order to form a first portion (14a) which has a first thickness and a second portion (14b) which has a second thickness greater than the first thickness; filling the cavity with polycrystalline silicon (40) so as to form a surface (41) which is continuous and substantially planar; - assembling the receiving substrate (20) and the donating substrate (10) at the surface (41); eliminating the support substrate (11) while preserving the active layer (13) and the sacrificial layer (12).
机译:该方法包括以下步骤: - 连续地提供接收基板(20)和捐赠基板(10),包括:支撑基板(11),可以相对于有源层选择性地蚀刻的牺牲层(12)( 13)和布置在有源层(13)上的氧化硅层(14); - 形成氧化物层(14)中的腔,以形成具有第一厚度和第二部分(14b)的第一部分(14a),其具有大于第一厚度的第二厚度;用多晶硅(40)填充腔,以形成连续且基本平面的表面(41); - 在表面(41)处组装接收基板(20)和捐赠基板(10);消除支撑基板(11),同时保持有源层(13)和牺牲层(12)。

著录项

  • 公开/公告号EP3850659A1

    专利类型

  • 公开/公告日2021-07-21

    原文格式PDF

  • 申请/专利权人 SOITEC;

    申请/专利号EP20190779352

  • 发明设计人 SCHWARZENBACH WALTER;

    申请日2019-09-11

  • 分类号H01L21/762;

  • 国家 EP

  • 入库时间 2022-08-24 20:02:15

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