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RF AMPLIFIERS WITH SERIES-COUPLED OUTPUT BONDWIRE ARRAYS AND SHUNT CAPACITOR BONDWIRE ARRAY
RF AMPLIFIERS WITH SERIES-COUPLED OUTPUT BONDWIRE ARRAYS AND SHUNT CAPACITOR BONDWIRE ARRAY
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机译:具有串联耦合输出键盘阵列的RF放大器和分流电容键合阵列
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摘要
Various embodiments relate to a packaged radio frequency (RF) amplifier device implementing a split bondwire where the direct ground connection of an output capacitor is replaced with a set of bondwires connecting to ground in a direction opposite to the wires connecting to the output of a transistor to an output pad. This is done in order to reduce the effects of mutual inductance between the various bondwires associated with the output of the RF amplifier device.
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