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Solid evaporation system of metal halide compound for thin film formation.

机译:薄膜形成金属卤化物化合物固体蒸发系统。

摘要

PROBLEM TO BE SOLVED: To provide a system for solidifying, evaporating and supplying a metal halogen compound for thin film deposition, capable of reducing particle contamination.;SOLUTION: The system for solidifying, evaporating and supplying a metal halogen compound for thin film deposition comprises an evaporation raw material vessel 100 for storing and evaporating the metal halogen compound for thin film deposition and a buffer tank 101 connected to the evaporation raw material vessel 100. The evaporation raw material vessel 100 includes a vessel main body having a vessel wall, a lid body, a fastening member and a joint member; the vessel wall has a double wall structure constituted of an inner wall member and an outer wall member and is constituted so as to introduce a carrier gas into the vessel main body through between the double wall structure. The vessel wall is constituted of copper having a purity of 99-99.9999%, aluminum having a purity of 99-99.9996% or titanium having a purity of 99-99.9999%, and each of the vessel main body, the lid body, the fastening member and the joint member is subjected to fluororesin coating and/or electrolytic polishing.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2020,JPO&INPIT
机译:要解决的问题:提供用于固化,蒸发并提供用于薄膜沉积的金属卤素化合物,能够降低颗粒污染的系统;解决方案:系统用于固化,蒸发并提供用于薄膜沉积包含金属卤素化合物用于存储和蒸发用于薄膜沉积的金属卤素化合物和连接到所述蒸发原料容器100的蒸发原料容器100包括具有血管壁的容器主体上的缓冲罐101,盖的蒸发原料容器100体,紧固部件和一个接头构件;容器壁具有构成的内壁部件和外壁部件的双层壁结构,并且构成以便通过双壁结构之间引入载气引入容器主体。血管壁构成的铜具有99-99.9999%的纯度,具有铝的99-99.9996%的纯度或具有99-99.9999%的纯度的钛,并且每个所述容器主体,盖体,所述紧固构件和接头构件经受氟树脂涂料和/或电解研磨; SELECTED附图中:图1; COPYRIGHT:(C)2020,JPO&INPIT

著录项

  • 公开/公告号JP6901153B2

    专利类型

  • 公开/公告日2021-07-14

    原文格式PDF

  • 申请/专利权人 株式会社高純度化学研究所;

    申请/专利号JP20190020584

  • 发明设计人 齋 篤;松本 浩;

    申请日2019-02-07

  • 分类号C23C16/448;H01L21/205;H01L21/31;C25F3/16;

  • 国家 JP

  • 入库时间 2024-06-14 21:48:30

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