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METHOD FOR PRODUCING A MULTILAYER FLOW FIELD PLATE FOR AN ELECTROCHEMICAL DEVICE, AND FLOW FIELD PLATE FOR AN ELECTROCHEMICAL DEVICE
METHOD FOR PRODUCING A MULTILAYER FLOW FIELD PLATE FOR AN ELECTROCHEMICAL DEVICE, AND FLOW FIELD PLATE FOR AN ELECTROCHEMICAL DEVICE
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机译:用于电化学装置的多层流场板的制造方法,以及用于电化学装置的流场板
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摘要
The aim of the invention is to provide a method for producing a multilayer flow field plate for an electrochemical device, comprising the following: producing at least one sealing element from an elastic material on a first flow field plate layer of the flow field plate; connecting the first flow field plate layer of the flow field plate with the sealing element produced thereon and a second flow field plate layer of the flow field plate by welding by means of a welding energy source along at least one connecting weld seam, in the case of which method a sealing element produced on the first flow field plate layer is reliably protected from being impaired by a subsequent welding process and preferably the design freedom of the structure of the electrochemical unit is increased. This aim is achieved, according to the invention in that the second second flow field plate layer faces the welding energy source during the welding process and that a molten pool produced by means of the welding energy source does not completely penetrate the first flow field plate layer during the welding process.
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