首页> 外国专利> METHOD FOR PRODUCING A MULTILAYER FLOW FIELD PLATE FOR AN ELECTROCHEMICAL DEVICE, AND FLOW FIELD PLATE FOR AN ELECTROCHEMICAL DEVICE

METHOD FOR PRODUCING A MULTILAYER FLOW FIELD PLATE FOR AN ELECTROCHEMICAL DEVICE, AND FLOW FIELD PLATE FOR AN ELECTROCHEMICAL DEVICE

机译:用于电化学装置的多层流场板的制造方法,以及用于电化学装置的流场板

摘要

The aim of the invention is to provide a method for producing a multilayer flow field plate for an electrochemical device, comprising the following: producing at least one sealing element from an elastic material on a first flow field plate layer of the flow field plate; connecting the first flow field plate layer of the flow field plate with the sealing element produced thereon and a second flow field plate layer of the flow field plate by welding by means of a welding energy source along at least one connecting weld seam, in the case of which method a sealing element produced on the first flow field plate layer is reliably protected from being impaired by a subsequent welding process and preferably the design freedom of the structure of the electrochemical unit is increased. This aim is achieved, according to the invention in that the second second flow field plate layer faces the welding energy source during the welding process and that a molten pool produced by means of the welding energy source does not completely penetrate the first flow field plate layer during the welding process.
机译:发明内容本发明的目的是提供一种用于为电化学装置制造多层流场板的方法,包括以下内容:在流场板的第一流动场板层上产生至少一个密封元件。将流场板的第一流场板层用在其上产生的密封元件和流场板的第二流场板层,通过沿着沿着至少一个连接的连接焊缝焊接,在壳体中焊接其中方法在第一流动场板层上产生的密封元件可靠地保护免受随后的焊接工艺的损害,并且优选地增加了电化学单元的结构的设计自由度。根据本发明,实现了该目的,因为在焊接过程中,第二第二流动场板层面向焊接能量源,并且通过焊接能量源产生的熔池不完全穿透第一流场板层在焊接过程中。

著录项

  • 公开/公告号WO2021130016A1

    专利类型

  • 公开/公告日2021-07-01

    原文格式PDF

  • 申请/专利权人 ELRINGKLINGER AG;

    申请/专利号WO2020EP85117

  • 发明设计人 STAHL PETER;KRAFT JÜRGEN;

    申请日2020-12-08

  • 分类号H01M8/0206;H01M8/0258;H01M8/0267;H01M8/0271;H01M8/0273;H01M8/0297;H01M8/0284;

  • 国家 EP

  • 入库时间 2022-08-24 19:53:05

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