DUSTPROOF STRUCTURE FOR MEMS DEVICE AND MEMS MICROPHONE PACKAGING STRUCTURE

摘要

Disclosed in the present invention are a dustproof structure for an MEMS device and an MEMS microphone packaging structure. The dustproof structure for an MEMS device comprises a mesh membrane and a support; the mesh membrane has a fixed connection region and a sound transmission region, the fixed connection region surrounds the sound transmission region, and the fixed connection region is located at an edge of the mesh membrane; the support has a through opening, and the opening corresponds to the position of the sound transmission region; and the support comprises at least two support layers, a first support layer of the support layers is connected to one side of the fixed connection region, and the other support layers are sequentially laminated and distributed on the side of the first support layer away from the mesh membrane in the thickness direction of the mesh membrane, and the support layers have different coefficients of thermal expansion.