DUST-PROOF STRUCTURE, MICROPHONE PACKAGING STRUCTURE AND ELECTRONIC DEVICE

摘要

Disclosed are a dust-proof structure, a microphone packaging structure and an electronic device. The dust-proof structure comprises: a carrier, a through-hole being formed at the middle portion of the carrier; and a membrane, wherein the membrane comprises a grid structure and a connecting portion provided surrounding the grid structure, the grid structure covers one end of the through-hole, and the connecting portion is connected onto the carrier; the carrier comprises an organic material and a filler, and the thermal expansion coefficient of the filler is lower that of the organic material. One effect of the present invention is that, by adding into the carrier the filler having a thermal expansion coefficient that is lower than that of the organic material, the thermal expansion coefficient of the carrier is lowered and the amount of deformation of the carrier after heating is reduced in order to ensure that the dust-proof structure will not fall off or be damaged.