DUST-PROOF STRUCTURE, MICROPHONE PACKAGING STRUCTURE, AND ELECTRONIC DEVICE

摘要

Disclosed are a dust-proof structure, a microphone structure, and an electronic device. The dust-proof structure comprises: a carrier, a through hole being formed in the middle of the carrier, and the carrier being subjected to hydrophobic treatment to form a hydrophobic portion at the bottom of the carrier; and a membrane, the membrane comprising a grid structure and a connection portion surrounding the grid structure, the grid structure covering one end of the through hole, and the connection portion being connected to the carrier. The bottom of the carrier is the surface of the carrier distant from the membrane. The technical effect of the present invention is that the bonding strength between the dust-proof structure and a UV adhesive tape to which the structure is transferred is reduced by performing hydrophobic treatment on the surface of the carrier, so that the dust-proof structure can be removed from the UV adhesive tape more easily, without causing damage to the dust-proof structure.