首页> 外国专利> ULTRA-HIGH SPEED DIGITAL-TO-ANALOG (DAC) CONVERSION METHODS AND APPARATUS HAVING SUB-DAC SYSTEMS FOR DATA INTERLEAVING AND POWER COMBINER WITH NO INTERLEAVING

ULTRA-HIGH SPEED DIGITAL-TO-ANALOG (DAC) CONVERSION METHODS AND APPARATUS HAVING SUB-DAC SYSTEMS FOR DATA INTERLEAVING AND POWER COMBINER WITH NO INTERLEAVING

机译:超高速数模(DAC)转换方法和具有子DAC系统的数据交错和功率组合器,没有交织

摘要

A ultra-high speed DAC apparatus (e.g., with a full sampling frequency not less than 20 GHz) may include one or more digital pre-coders and DAC modules. Each DAC module may include multiple current-mode DAC systems and a first power combiner. The gate length of transistors within each DAC module may be between 6 and 40 nm. Each current-mode DAC system includes a transmission line (e.g., 40 to 80 microns long) coupled to multiple interleaving sub-DAC systems (within the current-mode DAC systems) and the first power combiner. The first power combiner combines, without interleaving, analog signals that have been interleaved within the current-mode DAC systems. The impedance of the first power combiner matches the impedance of each of the current-mode DAC systems and a load of the first power combiner. A second power combiner combines, without interleaving, analog signals from the DAC modules.
机译:超高速DAC装置(例如,具有不小于20GHz的完全采样频率)可以包括一个或多个数字预编码器和DAC模块。每个DAC模块可以包括多个电流模式DAC系统和第一功率组合器。每个DAC模块内的晶体管的栅极长度可以在6到40nm之间。每个电流模式DAC系统包括耦合到多个交织的子DAC系统(在电流模式DAC系统内)和第一功率组合器的传输线(例如,40至80微米长)。第一功率组合器组合而不结合交错模拟信号,该模拟信号已经在电流模式DAC系统内交错。第一功率组合器的阻抗与每个电流模式DAC系统的阻抗与第一功率组合器的负载匹配。第二功率组合器组合,无需交错模拟信号来自DAC模块。

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