首页> 外国专利> CONTROL OF ELECTRIC FIELD EFFECTS IN A PRINTED CIRCUIT BOARD ASSEMBLY USING EMBEDDED NICKEL-METAL COMPOSITE MATERIALS

CONTROL OF ELECTRIC FIELD EFFECTS IN A PRINTED CIRCUIT BOARD ASSEMBLY USING EMBEDDED NICKEL-METAL COMPOSITE MATERIALS

机译:使用嵌入式镍 - 金属复合材料控制印刷电路板组件中的电场效应

摘要

A printed circuit board assembly (PCBA) controls an electrically-initiated device (EID) in an electric field. The PCBA includes a conductive layer, a dielectric layer, and a trans-conductive layer (TCL). The conductive layer of the PCBA designated protected areas. An electrical current with a predetermined current density is impressed in the conductive layer when the PCBA is in the electric field. The TCL is a nickel-metal composite metamaterial positioned between the conductive and dielectric layers and configured to change in shape or thickness in the electric field such that the impressed current is steered away from the conductive layer and into the dielectric layer to prevent premature activation of the EID. A system includes an outer housing, power supply, an EID such as a sonobuoy or medical device, and the PCBA, all of which are encapsulated in the housing. A method is also disclosed for manufacturing the PCBA.
机译:印刷电路板组件(PCBA)在电场中控制电发动的设备(EID)。 PCBA包括导电层,介电层和换型层(TCL)。 PCBA指定保护区域的导电层。当PCBA处于电场时,具有预定电流密度的电流在导电层中印象深刻。 TCL是位于导电和介电层之间的镍金属复合材料,并且被配置为在电场中的形状或厚度变化,使得造成的电流远离导电层并进入介电层以防止过早激活eid。系统包括外壳,电源,诸如Sonobuoy或医疗装置的EID,以及PCBA,所有这些都封装在壳体中。还公开了一种用于制造PCBA的方法。

著录项

  • 公开/公告号US2021204396A1

    专利类型

  • 公开/公告日2021-07-01

    原文格式PDF

  • 申请/专利权人 SPARTON CORPORATION;

    申请/专利号US202117194904

  • 发明设计人 LENDON L. BENDIX;DEREK TURNER;

    申请日2021-03-08

  • 分类号H05K1/02;H05K5/06;H05K9;H05K7/02;

  • 国家 US

  • 入库时间 2022-08-24 19:41:22

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