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Device and methods for reducing peak noise and peak power consumption in semiconductor devices under test

机译:降低经测试半导体器件峰值噪声和峰值功耗的装置和方法

摘要

A test device includes a test mounting circuit having a plurality of semiconductor devices mounted thereon as respective devices-under-test. Each device-under-test includes a corresponding delay control circuit and a target circuit therein. Test logic is provided, which is electrically coupled to the test mounting circuit. The test logic is configured to generate a test input(s), which is provided in parallel to the delay control circuits within the plurality of devices-under-test. The delay control circuits include at least first and second delay control circuits, which are configured to pass the test input(s) to corresponding first and second target circuits during respective first and second test time intervals that are out-of-phase relative to each other in order to achieve more uniform power consumption requirements of the test mounting circuit during testing.
机译:测试装置包括测试安装电路,该测试安装电路具有与其上安装的多个半导体器件相应的装置。每个设备欠测试包括相应的延迟控制电路和其中目标电路。提供测试逻辑,其电耦合到测试安装电路。测试逻辑被配置为生成测试输入,该测试输入,其并行地提供与在测试中的多个设备内的延迟控制电路中提供。延迟控制电路包括至少第一和第二延迟控制电路,其被配置为在相对于每个相对于每个相对于阶段异常的第一和第二测试时间间隔期间将测试输入和第二目标电路传递到相应的第一和第二目标电路其他为了在测试期间实现测试安装电路的更均匀的功耗要求。

著录项

  • 公开/公告号US11047908B2

    专利类型

  • 公开/公告日2021-06-29

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号US201816227424

  • 发明设计人 JONG-TAE HWANG;

    申请日2018-12-20

  • 分类号G01R31/28;G01R31/317;G01R31/3177;G01R31/3185;G01R31/319;

  • 国家 US

  • 入库时间 2022-08-24 19:39:02

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