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HALF-TIME CONSUMPTION AND PROCEDURE FOR SUPPLY

机译:供应的半场消耗和程序

摘要

A semiconductor element (100) is described, comprising a carrier (1),at least one semiconductor chip (2),which is mounted on the carrier (1) and has at least one first electrical contact (11) on a main surface of the semiconductor chip (2) turned off by the carrier (1). The semiconductor element comprises an electrical insulating layer (3) mounted on the carrier (1) and at least one electrical connecting layer (4),which is led through the electrically insulating layer (3) to the first electrical contact (11), the electrically insulating layer (3) having a photostructuring material. A process for the production of the semiconductor element (100) is also indicated.
机译:描述了半导体元件(100),包括载体(1),至少一个半导体芯片(2),所述半导体芯片(2)安装在载体(1)上,并且在主表面上具有至少一个第一电触点(11)半导体芯片(2)由载体(1)关闭。半导体元件包括安装在载体(1)上的电绝缘层(3)和至少一个电连接层(4),所述电连接层(4)通过电绝缘层(3)通过电绝缘层(3)所述,所述电连接层(3)被引导到所述第一电触点(11),所述电绝缘层(3)具有光泽材料。还指示用于制造半导体元件(100)的过程。

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