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HALF-TIME CONSUMPTION WITH INTEGRATED CAPACITY STRUCTURE AND PROCEDURE FOR SUPPLY

机译:容量结构与供应流程​​相结合的半时消耗

摘要

A semiconductor component has an insulating layer which is formed on a semiconductor substrate and in which a capacitance structure (K) is formed. The capacitance structure (K) has at least two metallization planes (1 to 7) which are arranged parallel to one another and are each connected to an electrical connecting line. Arranged between the metallization planes (1 to 7) is at least one electrically conductive region (1a to 1j; 2a to 2j; 31a to 36a; 41a to 46a; 5a to 5f) for producing a capacitance surface, the electrically conductive region (1a to 1j; 2a to 2j; 31a to 36a; 41a to 46a; 5a to 5f) being electrically connected only to one of the metallization planes (1 to 7).
机译:半导体组件具有绝缘层,该绝缘层形成在半导体衬底上并且在其中形成电容结构(K)。电容结构(K)具有至少两个彼此平行布置的金属化平面(1至7),并且每个金属化平面连接至电连接线。在金属化平面(1至7)之间布置至少一个导电区域(1a至1j; 2a至2​​j; 31a至36a; 41a至46a; 5a至5f),该导电区域(1a)在图1a至1j; 2a至2​​j; 31a至36a; 41a至46a; 5a至5f中仅电连接至金属化平面(1至7)之一。

著录项

  • 公开/公告号DE50307293D1

    专利类型

  • 公开/公告日2007-06-28

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号DE20035007293T

  • 发明设计人 BENETIK THOMAS;RUDERER ERWIN;

    申请日2003-03-24

  • 分类号H01L23/522;H01L27/04;H01L21/822;

  • 国家 DE

  • 入库时间 2022-08-21 20:28:38

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