METHOD FOR ACTIVATING AT LEAST ONE SURFACE, ACTIVATION COMPOSITION, AND USE OF THE ACTIVATION COMPOSITION TO ACTIVATE A SURFACE FOR ELECTROLESS PLATING

摘要

The present invention is directed to a method for activating at least one surface of a substrate, the method comprising the stepsa) providing the substrate having the at least one surface;b) optionally, pretreating the at least one surface of the substrate with a pretreating composition;c) optionally, conditioning the at least one surface of the substrate with a conditioning composition;d) contacting the at least one surface of the substrate with an activation composition comprisingi) copper ions; andii) at least one unsubstituted or substituted N-heteroaromatic compound;e) contacting the at least one surface of the substrate obtained after step d) with a reducing agent containing composition such that copper ions are reduced to metallic copper on said surfaceand thereby activating the at least one surface of the substrate.