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Capacitance measurement without separation from high power circuits

机译:电容测量而不从高功率电路分离

摘要

Problem to be solved: to provide a method and apparatus for semiconductor processing by plasma assisted processing.This method isA) providing a substrate in each of a plurality of stations;B) according to the RF power parameters configured to reduce variations between stationsThe RF power including the first target frequency is distributed to a plurality of stations;This creates a plasma within the station.C) adjusting the impedance matching circuit for a first station included in a plurality of stations;Distributing RF power to the first stationI) the capacitance of the capacitor of the impedance matching circuitThe impedance matching circuit is measured without separating the capacitor.II) according to the capacitance and RF power parameters measured inBy adjusting the capacitance of the capacitorAdjusting the impedance matching circuitD) performing a semiconductor processing operation on the substrate at each station;.Fig.4
机译:要解决的问题:提供通过等离子体辅助处理的半导体处理的方法和装置。该方法ISA)在多个站中的每一个中提供基板;b)根据被配置为减少包括第一目标频率的站点RF功率之间的变化的RF功率参数分布到多个站点;这在内部创造了一个等离子体Station.c)调整包括在多个站中的第一站的阻抗匹配电路;将RF功率分配到第一站)阻抗匹配电路的电容器的电容在不分离电容的情况下测量阻抗匹配电路.II)根据电容和RF功率参数测量的,在每个站点调整阻抗匹配电路的电容的电容,在每个站处执行半导体处理操作; .fig.4

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