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TWO-DIMENSIONAL MATERIAL PRINTER AND TRANSFER SYSTEM AND METHOD FOR ATOMICALLY LAYERED MATERIALS

机译:二维材料打印机及传输系统及其原子分层材料的方法

摘要

Precision and chip contamination-free placement of two-dimensional (2D) material and van der Waals (VDW) layered materials accelerates both the study of fundamental properties and novel device functionality. The system transfers 2D materials utilizing a combination of a narrow transfer-stamper and viscoelastic and optically transparent film. Precise placement of individual 2D materials results in vanishing cross-contamination to the substrate. The 2D printer results in an aerial cross-contamination improvement of two to three orders of magnitude relative to state-of-the-art transfer methods from a source of average area sub um{circumflex over ( )}2. The transfer-stamper does not physically harm any micro/nanostructures preexisting on the target substrates receiving the 2D material such as, nanoelectronics, waveguides or micro-ring resonators. Such accurate and substrate-benign transfer method for 2D and VDW layered materials provides rapid device prototyping due to its high time-reduction, accuracy, and contamination-free process.
机译:无需芯片污染的二维(2D)材料和范德瓦尔斯(VDW)层状材料的精确和芯片污染放置加速了基本属性和新型设备功能的研究。系统使用窄传递压模和粘弹性和光学透明膜的组合转印器2D材料。各个2D材料的精确放置导致对基材的交叉污染。 2D打印机相对于来自平均区域子UM um {Ciffecflex Over()} 2的源极值的传输方法,可以产生两到三个数量级的空中交叉污染改善。转移压模不会物理地损害预先存在于接收诸如纳米电子,波导或微环谐振器的靶基板上的任何微/纳米结构。对于2D和VDW分层材料的这种准确和基板 - 良性传递方法提供了快速的设备原型,因为它的高度减少,准确性和无污染过程。

著录项

  • 公开/公告号US2021178738A1

    专利类型

  • 公开/公告日2021-06-17

    原文格式PDF

  • 申请/专利权人 THE GEORGE WASHINGTON UNIVERSITY;

    申请/专利号US202117176142

  • 发明设计人 ROHIT ANIL HEMNANI;VOLKER J. SORGER;

    申请日2021-02-15

  • 分类号B32B37;B32B41;H01L29/16;B82Y40;H01L21/762;B82Y10;

  • 国家 US

  • 入库时间 2022-08-24 19:24:32

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