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CHIP-SCALE SILICON-BASED HYBRID-INTEGRATED LIDAR SYSTEM

机译:基于芯片级硅的混合集成LIDAR系统

摘要

A chip-scale silicon-based hybrid-integrated LiDAR system, wherein a transmitting end thereof sequentially comprises a narrow-linewidth tunable laser source, a silicon-nitride-based beam splitter, a silicon-based phase shifter array and a silicon-nitride-based unidirectional transmitting antenna array w.r.t the optical path. Based on the principle of reciprocity of light propagation, the receiving end thereof sequentially comprises a silicon nitride unidirectional receiving antenna array, a silicon nitride beam splitter and a silicon-based coherent receiving module. It also comprises a backup system and an electric controller as the driver of the phase shifters and the processing module. Modules on the silicon platform and the silicon nitride platform are monolithic integrated in a multilayer sandwiched fashion by means of a tapered silicon/silicon nitride evanescent inter-layer coupler; and a gain chip in the tunable laser module and a silicon nitride waveguide are hybrid-integrated by horizontal coupling.
机译:基于芯片级的硅基混合集成LIDAR系统,其中其发送端顺序地包括窄线宽可调激光源,硅 - 氮化物的分束器,硅基移移器阵列和氮化硅 - 氮化物 - 基于单向传输天线阵列WRT光路。基于光传播的往复性的原理,其接收端顺序地包括氮化硅单向接收天线阵列,氮化硅分束器和硅基的相干接收模块。它还包括备用系统和作为相移器和处理模块的驱动器的电控制器。硅平台上的模块和氮化硅平台是通过锥形硅/氮化硅渐逝的层间耦合器在多层夹在多层夹层时的单片。通过水平耦合,可调谐激光模块和氮化硅波导中的增益芯片是混合集成的。

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