TWO COMPONENT (2K) CURABLE ADHESIVE COMPOSITION

摘要

The present invention is directed to a curable and debondable two-part (2K) hybrid adhesive composition comprising: i) a first part comprising: a) epoxy resin; b) (meth)acrylate monomer; c) an electrolyte; d) a solubilizer; and e) a filler; and, ii) a second part comprising: a) a curing agent consisting of at least one compound possessing at least two epoxide reactive groups per molecule; b) an accelerator; and, c) a filler.