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Semiconductor chip package comprising a leadframe connected to a substrate and a semiconductor chip, and a method for fabricating the same
Semiconductor chip package comprising a leadframe connected to a substrate and a semiconductor chip, and a method for fabricating the same
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机译:半导体芯片封装,包括连接到基板和半导体芯片的引线框架,以及制造该引线框架的方法
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摘要
A semiconductor chip package may comprise a semiconductor chip disposed on a substrate. The semiconductor chip may have a first surface and a second surface. The first surface of the semiconductor chip may be connected to the substrate. The semiconductor chip package may comprise a leadframe that includes a first lead and a second lead. The first lead of the leadframe may be directly attached to the second surface of the semiconductor chip. The second lead of the leadframe may be directly attached to the substrate. An important aspect in development of the semiconductor chip package is improvement of connections between different components within the package.
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