Sinter-bonding paste composed of Cu and CuO particles, and bonding method thereby

摘要

The present invention relates to a sintered bonding paste, wherein the mixed particles prepared by mixing cuprous particles having an average particle size of 0.5 to 45 μm and copper oxide particles having an average particle size of 50 to 450 nm, and 100 parts by weight of the mixed particles The technical gist is a copper and copper oxide mixed sintering bonding paste, characterized in that 10 to 30 parts by weight of a reduction inducer is mixed, and a bonding method using the same. Thereby, by reducing and generating nano-grade copper particles through heating at a specific temperature under pressure to realize rapid in-situ sintering characteristics, it is possible to dramatically reduce the bonding process time and secure production competitiveness.