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Clustering Sub-Care Areas Based on Noise Characteristics
Clustering Sub-Care Areas Based on Noise Characteristics
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机译:基于噪声特性的聚类子护理区域
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摘要
A care area is determined in an image of a semiconductor wafer. The care area is divided into sub-care areas based on the shapes of polygons in a design file associated with the care area. A noise scan of a histogram for the sub-care areas is then performed. The sub-care areas are clustered into groups based on the noise scan of the histogram.
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