MOUNTING WIRING BOARD, ELECTRONIC COMPONENT MOUNTED BOARD, METHOD OF MOUNTING ELECTRONIC COMPONENT, MICROWAVE HEATING METHOD, AND MICROWAVE HEATING DEVICE

摘要

Provided are: a mounting wiring board including a base material, an electrode part disposed on the base material, and a heat generation pattern disposed on the electrode part and heated by stationary waves of microwaves, wherein the occupied area of the heat generation pattern is smaller than the area of the upper surface of the electrode part; an electronic component mounting board using this mounting wiring board; a method of mounting this electronic component; and a microwave heating method and microwave heating device that heats an object to be heated disposed through the heat generation pattern.