首页> 外国专利> MULTI-FINGER ROBOT APPARATUS, ELECTRONIC DEVICE MANUFACTURING APPARATUS, AND METHODS ADAPTED TO TRANSPORT MULTIPLE SUBSTRATES IN ELECTRONIC DEVICE MANUFACTURING

MULTI-FINGER ROBOT APPARATUS, ELECTRONIC DEVICE MANUFACTURING APPARATUS, AND METHODS ADAPTED TO TRANSPORT MULTIPLE SUBSTRATES IN ELECTRONIC DEVICE MANUFACTURING

机译:多指机器人装置,电子设备制造装置和方法适于在电子设备制造中传输多个基板

摘要

Electronic device manufacturing apparatus and robot apparatus are described. The apparatus are configured to efficiently pick and place substrates wherein the robot apparatus includes an arm component and a blade component. The blade component may comprise two or more end effectors that can retrieve and place two or more substrates at a time. The apparatus can include multiple arm components and multiple blade components. Each blade component can comprise two or more end effectors to carry two or more substrates at one time. The blade components can move independent of one another or may be dependently connected.
机译:描述了电子设备制造装置和机器人装置。该装置被配置为有效地拾取和放置基板,其中机器人装置包括臂部件和刀片部件。刀片部件可包括两个或更多个可以一次检索和放置两个或更多个基板的最终效应器。该装置可包括多个臂部件和多个刀片部件。每个刀片部件可包括两个或更多个末端效应器,以一次携带两个或更多个基板。刀片组件可以彼此独立地移动或者可以依赖地连接。

著录项

  • 公开/公告号WO2021096987A1

    专利类型

  • 公开/公告日2021-05-20

    原文格式PDF

  • 申请/专利权人 APPLIED MATERIALS INC.;

    申请/专利号WO2020US60052

  • 发明设计人 HUDGENS JEFFREY C.;MERRY NIR;

    申请日2020-11-11

  • 分类号H01L21/677;H01L21/687;B25J9/04;B25J15;

  • 国家 US

  • 入库时间 2024-06-14 21:34:45

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