NANOCRYSTALLINE DIAMOND CARBON FILM FOR 3D NAND HARDMASK APPLICATION

摘要

Also disclosed herein are nanocrystalline diamond layers and methods for using them for use in forming semiconductor devices. The device may comprise a substrate having a processing surface and a support surface, a device layer formed on the processing surface, and a nanocrystalline diamond layer formed on the processing layer, wherein the nanocrystalline diamond layer has an average crystal grain size of 2 nm to 5 nm. . The method includes positioning a substrate in a process chamber, depositing a device layer on a processing surface, depositing a nanocrystalline diamond layer on the device layer, the nanocrystalline diamond layer having an average crystal grain size of 2 nm to 5 nm. Steps, patterning and etching the nanocrystalline diamond layer, etching the device layer to form a feature, and ashing the nanocrystalline diamond layer from the surface of the device layer.