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3D NAND NANOCRYSTALLINE DIAMOND CARBON FILM FOR 3D NAND HARDMASK APPLICATION

机译:用于3D NAND硬质合金应用的3D NAND纳米晶金刚石碳膜

摘要

Nanocrystalline diamond layers for use in forming semiconductor devices and methods for using them are also disclosed herein. The device may include a substrate having a processing surface and a support surface, a device layer formed on the processing surface, and a nanocrystalline diamond layer formed on the processing layer, wherein the nanocrystalline diamond layer has an average crystal grain size of 2 nm to 5 nm . The method includes: positioning a substrate in a process chamber; depositing a device layer on the processing surface; depositing a nanocrystalline diamond layer on the device layer, the nanocrystalline diamond layer having an average crystal grain size of 2 nm to 5 nm Patterning and etching the nanocrystalline diamond layer, etching the device layer to form a feature, and ashing the nanocrystalline diamond layer from the surface of the device layer.
机译:本文还公开了用于形成半导体器件的纳米晶金刚石层及其使用方法。该装置可以包括:具有处理表面和支撑表面的基板;在该处理表面上形成的装置层;以及在该处理层上形成的纳米晶金刚石层,其中该纳米晶金刚石层的平均晶粒尺寸为2nm至1nm。 5纳米。该方法包括:将基板放置在处理室中;以及将基板放置在处理室中。在处理表面上沉积器件层;在器件层上沉积纳米晶金刚石层,该纳米晶金刚石层具有2 nm至5 nm的平均晶粒尺寸对纳米晶金刚石层进行图案化和蚀刻,蚀刻器件层以形成特征,并从器件层的表面。

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