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Sealant laminated composite and method for sealing a semiconductor devices mounting substrate using the sealant laminated composite
Sealant laminated composite and method for sealing a semiconductor devices mounting substrate using the sealant laminated composite
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机译:密封剂层压复合材料和用于使用密封膜层压复合材料密封半导体器件安装基板的方法
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摘要
It is an object of the invention to provide a sealant laminated composite that is very high in versatility, even when a large diameter or thin substrate or wafer is sealed, can prevent the substrate or wafer from warping and the semiconductor devices from peeling, can collectively seal a semiconductor devices mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor devices forming surface of a wafer on which semiconductor devices are formed on a wafer level, and can provide a sealant laminated composite that is excellent in the heat resistance and humidity resistance after sealing. A sealant laminated composite for collectively sealing a semiconductor devices mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor devices forming surface of a wafer on which semiconductor devices are formed includes: a support wafer; and an uncured resin layer constituted of an uncured thermosetting resin formed on one side of the support wafer.
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