METHOD OF BATCH DIFFUSION SOLDERING FOR SOLDERING SEMICONDUCTOR DIES TO A SUBSTRATE ; CORRESPONDING ELECTRONIC DEVICE

摘要

A method of batch soldering includes: forming a soldered joint (208) between a metal region (212) of a first semiconductor die (200') and a metal region of a substrate (202) using a solder preform via a soldering process which does not apply pressure directly to the first semiconductor die (200'), the solder preform having a maximum thickness of 30 µm and a lower melting point than the metal regions; setting a soldering temperature of the soldering process so that the solder preform melts and fully reacts with the metal region (212) of the first semiconductor die (200') and the metal region of the substrate (202) to form one or more intermetallic phases throughout the entire soldered joint (208), each intermetallic phase having a melting point above the preform melting point and the soldering temperature; and soldering a second semiconductor die (200'') to the same or different metal region of the substrate (200), without applying pressure directly to the second semiconductor die (200'').