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SUBSTRATE INTEGRATED SLOW-WAVE AIR WAVEGUIDE FOR IMPROVING PERFORMANCE OF MICROWAVE PASSIVE DEVICE

机译:基板集成慢波空气波导,用于提高微波无源装置的性能

摘要

Disclosed in the present invention is a substrate integrated slow-wave air waveguide for improving the performance of a microwave passive device. The substrate integrated slow-wave air waveguide comprises an upper-layer dielectric slab, a middle-layer dielectric slab and a lower-layer dielectric slab; the upper-layer dielectric slab, the middle-layer dielectric slab and the lower-layer dielectric slab are fixedly connected, the upper-layer dielectric slab, the middle-layer dielectric slab and the lower-layer dielectric slab form a three-layer waveguide structure in sequence from top to bottom, a first bottom-layer metal layer covers the lower surface of the upper-layer dielectric slab, a first top-layer metal layer covers the upper surface of the middle-layer dielectric slab, a second top-layer metal layer covers the upper surface of the lower-layer dielectric slab, and a second bottom-layer metal layer covers the lower surface thereof. The present technical solution maintains the advantages of a substrate integrated air waveguide, and also overcomes, by combining with the slow-wave effect, the problem that it is difficult to combine a high Q value with miniaturization, and thus has an important application value in a low-loss microwave integrated circuit, and is more suitable for being applied to a microwave circuit system which has strict requirements on many aspects such as miniaturization, high Q value, and low loss.
机译:本发明公开了一种基板集成慢波空气波导,用于改善微波无源装置的性能。基板集成慢波空气波导包括上层电介质板,中间层电介质板和下层电介质板;上层电介质板,中层电介质板和下层电介质板固定地连接,上层电介质板,中层电介质板和下层电介质板形成三层波导依次从上到下的结构,第一底层金属层覆盖上层电介质板的下表面,第一顶层金属层覆盖中层电介质板的上表面,第二顶 - 层金属层覆盖下层电介质板的上表面,第二底层金属层覆盖其下表面。本技术解决方案维持基板集成空气波导的优点,并且还通过与慢波效应组合来克服的优点,难以将高Q值与小型化结合的问题,因此具有重要的应用价值一个低损耗微波集成电路,更适合于应用于微波电路系统,这对许多方面进行了严格的要求,例如小型化,高Q值和低损耗。

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